World's Smallest, Fully-rugged, Artificial Intelligence System

with Advanced Video Capture


12 Core Arm® 64-bit CPU
2048 CUDA® Cores


64GB 256-bit LPDDR5
64GB eMMC5


Dual 100GigE Fiber
Quad 10GigE w/ PoE+
Quad HDSDI/CoXPress


5G Cell


  • Highest SWaP high-performance rugged AI system
  • Ultra-small at 6”x4.75”x2” and 2.1lbs.
  • 275TOPS (INT-8 AI Performance)
  • 2048 CUDA® cores and 64 Tensor cores
  • 12 core Arm® Cortex™ 64-bit CPU
  • Operates @ 2.2GHz max or 1.6GHz nominal
  • 3MB L2 and 6MB L3 Cache
  • 64GB 256-bit LPDDR5 (204 GB/s)
  • 2x NVIDIA® v2.0 DL accelerator @ 1.6GHz
  • Vast array of video encoding: H.265, H.264, VP9 and AV1
  • Up to 16TB of native SSD (2x M.2), 64GB of eMMC 5.1
  • Quad 12G CoaXPress® Link (on RMC-50)
  • Quad 3G-SDI with Camera Control (RS232/422/485)
  • Dual 100Gb fiber Ethernet port
  • Quad 10Gb Ethernet ports w/ PoE+
  • 8K x 60Hz multimode DisplayPort 1.4a port
  • USB-C, GigE, USB2 and UART Service port
  • Voltage, Shock and Temp sensors
  • Eight tri-color LEDs for status and messaging 
  • Single +20VDC power operation
  • Dual fan control with tachometer for external cooling


  • Fully-sealed, submersible and conduction cooled
  • Stackable, modular, interlocking enclosures (pat. pending)
  • Rugged “QuadroLock™” wedgelocks secure systems together or in a separate chassis (pat. pending)
  • Fully-rugged high speed 40 Gbps connectors (pat. pending)
  • Ultra-small, fully rugged “Smart” 700W power connector with ultra-low EMI (pat. pending)
  • Connectors for 2x 100Gb Fiber, 4x 10GBase-TX Ethernet, 4x Camera control, DisplayPort, USB3, System I/O, SAM™ I/O,
    4x 3G-SDI, 4x CoaXPress® and Service port
  • Self-retaining dust caps for each I/O connector


  • Over 30 Rugged Mezzanine Carriers (RMC) for easy system customization and expansion
  • MIL-STD-1275 Power Supply with Boost and 50m/s hold
  • 4x isolated Thunderbolt™ 4 power for each port at 100W
  • UPS back-up power supply for hours of operation
  • External cooling with sealed fans for wearable applications
  • Over ten X9 support modules (Switch, Storage, I/O, AI etc.)
  • Mounting plates with or without radiators for various flexible mounting positions in any orientation
  • Available in low-cost industrial grade or fully-rugged (R5)
  • Fiber Thunderbolt™ 4 (LightBolt™) connectors delivering 100W power up to 50 meters


The X9 AI system is the first rugged system to utilize the NVIDIA® system-on-module technology named the Jetson Orin™ processor family. This family of systems-on-module are targeted for autonomous applications where live data collection and analysis in real time is essential. This flagship product line from NVIDIA® is being deployed in Commercial, Industrial and now Military applications such as UAV/UAS, autonomous vehicles, and airborne applications.

GMS X9 AI utilizes NVIDIA’s most recent Jetson Orin™ module. The Jetson Orin™ contains 2048 CUDA® engines with an incredible 275TFLOPS and 64 Tensor cores operating @ 1.3GHz. The Jetson Orin™ has 12 Arm® Cortex® 64bi/cp with 3MB of L2 Cache and 6MB of L3 Cache operating at 2.2 GHz max and 1.6GHz nominal. The Orin supports 64GB memory which is 256-bit wide with a 204.8 GB/s transfer rate.

The Orin is connected to two RMC I/O carrier modules to expand the system I/O to enhance the functionality of the system. The primary expansion card provides quad 10GBase-TX Ethernet ports with PoE+ to power cameras and target sensors. Additionally, it provides quad 3G-SDI ports for video capture via an FPGA. Each camera also supports an RS232/422/485 port for camera control such as PTZ and the other functions on the camera. This module also provides dual 40GigE fiber port and dual M.2 (2280) for storage. Additional I/O such as 8K x 60Hz multi-mode 1.4a Display Port, USB-C, and sensors such as Shock, Temp, and Tamper.

The second expansion site is a Rugged Mezzanine Module (RMC-50). Although there are over 30 RMC modules that may be installed in this location, GMS’ standard offering is a Quad CoaXPress® module. CoaXPress® is the most advanced technology in video standards, with its digital interface developed for high-speed image transmission in machine vision applications. The CoaXPress® standard supports up to 6.25 Gbps per coaxial cable and soon will support 12.5 Gbps. Unlike other video formats such as CameraLink, CoaXPress® transmission data is in packet form. This allows multiple cameras to utilize the same link, much like cellular data. This unique feature opens up applications where it has not been possible due to size, cost and power.


  • SWaP-E:

    World's smallest, fully-rugged AI System

  • Size:

    6" x 4.75" x 2"

  • Weight:

    2.1 lbs.

  • Power:

    Configurable to 100W or less “no Power Delivery”
    110/220 VAC (60 Hz) option available

  • MIL-STD:

    MIL-STD: MIL-STD-810, MIL-S-901, MIL-STD-461, 
    DO-160, optional MIL-STD-704

  • Temperature:

    Operates over extended temp -40°C to +85°C


Our Mission

Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.

All GMS products are proudly designed and manufactured in the U.S.A.

Contact Us

General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91737

Local (909) 980-4863
Toll Free (800) 307-4863

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