The X9 Cooler module is a unique patent pending cooling solution designed to cool an array of X9 modules in a system. Its unique interlocking fins mate directly on all four sides (top, bottom, and both sides) with other X9 systems thus it cools four adjacent systems at the same time. The QuadroLock™™ (patent pending) wedge locks assure a tight, low thermal resistance path to all attached X9 systems.

The X9 Cooler comes in two versions, Active cooling or Passive cooling. In extreme environments where the ambient temperature is so high (40°C+) regardless of airflow, the temperature rise cannot be avoided. In these applications the X9 Cooler utilizes active Peltier cooling module which cools all four sides to sub-ambient temperatures. The heat from these active coolers are removed to the outside via efficient Vapor phase change heatsinks with fins which are cooled with two high speed sealed fans with variable speed and tachometer.

The onboard controller measures the temperature of each side of the X9 module as well as the ambient temperature to cool each side as needed for optimum power utilization. The fan speeds are also controlled, with Tachometer feedback to assure proper operations. The data from each sensor and fan are communicated to the Host CPU by SMB.

For less demanding environments and temperatures, the X9 Cooler can be ordered without active cooling to lower the Host’s fin temperature closer to ambient temperature.

The X9 cooling is the ideal solution for UAV and applications where the chassis does not provide cold plate cooling.