1/4 ATR OPENVPX

CROSS DOMAIN SOLUTION

Rugged Conduction-Cooled Cross Domain Solution - Optimized for Ground Vehicle Applications, UAS and Mobile Deployment

DOMAIN PROCESSORS

Intel® Xeon® D / Xeon® W
Up to 20 Cores
Optional GPGPU processor

DOMAIN SECURITY

TACLANE® HAIPE® Encryptor
CAC ISO/IEC 7816
System Zero w/ Intruder Alert

REMOVABLE STORAGE

2x M.2 SSDs per domain
Up to 8x M.2 SSDs Red domain
FIPS 140-2

ETHERNET

2x 1/10 GigE per domain
4x 10 GigE Red domain
Opt. 2x100 GigE Fiber

OVERVIEW

  • Pre-configured OpenVPX cross domain solution in
    ¼ ATR chassis with six slots
  • Optimized for space-constrained applications like UAS, portable TOC, and ground vehicles
  • Uses commercial high TRL GMS X9 VENOM™ 3U OpenVPX modules with optional A4500 Nvidia® GPU

CHASSIS

  • Embedded heat exchanger with integrated radiator
    to rear panel; patent-pending thermal design using GMS TwoCool™ technology
  • Four-fan cooling assembly
  • Can be adapted for plenum cooling and avionics
    tray or vetronics style mount

SECURITY

  • KG-175N TACLANE® HAIPE® Type 1 Encryptor
  • Common Access Card (CAC) support
    • ISO/IEC 7816 Part 1 to 4
    • EMV 2011 Ver 4.3 Level 1 (compliant)
  • 2x FIPS 140-2 SSDs, with hardware secure erase
  • GMS Enhanced SecureDNA™ includes hardware secure erase, BIOS erasure, anti-tamper switches, Intruder signal, and Zeroize-when-off
  • Maskable/non-maskable hand-wired security

RED DOMAIN CONFIGURATION

X9 SPIDER™ HOST CPU + I/O

  • Intel® Xeon® D-2700 (20 Cores) or Xeon® W (8 Cores)
  • Up to 128 GB DDR4 ECC DRAM
  • 2x 1 GigE and 4x 10 GigE ports to front panel
  • High speed I/O reserved for expansion:
    used for SDR, A4500 Nvidia ® GPGPU, Ethernet switch, or other specialty I/O
  • X9 VENOM: DC Power Supply
    • 1000 W; MIL-STD-1275 for wide input voltage range
  • Common Access Card for authentication
  • Removable M.2 2280 SSD; FIPS 140-2 and CSfC
  • Optional 2x 100GigE fiber for RDMA

BLACK DOMAIN CONFIGURATION

X9 SPIDER™ HOST CPU + I/O

  • Intel® Xeon® D-2700 (20 Cores) or Xeon® W (8 Cores)
  • Up to 128 GB DDR4 ECC DRAM
  • 2x 1 GigE ports to front panel
  • High speed I/O reserved for expansion:
    used for SDR, A4500 Nvidia® GPGPU, Ethernet switch, or other specialty I/O
  • X9 VENOM: DC Power Supply
    • 1000 W; MIL-STD-1275 for wide input voltage range
  • Removable M.2 2280 SSD; FIPS 140-2 and CSfC
  • Optional 2x 100GigE fiber for RDMA

GENERAL DESCRIPTION

At the center of GMS’s ¼ ATR VPX Cross Domain solution is its X9 VENOM™ 3U OpenVPX modules, available both in single slot and dual slot versions. The X9 VENOM family is the ultimate in 3U OpenVPX products and is OpenVPX designed for MOSA (Modular Open Standard Approach) and developed in alignment with the SOSA™ Technical Standard.


X9 VENOM™’s clamshell heatsink design employs GMS’s patented RuggedCool™ and Diamond RuggedCool2™ cooling technology for long life in extended temperature environments. GMS camlocks are superior by providing a larger and more direct heat path from the OpenVPX LRU heat plane to the chassis. The chassis uses dedicated vapor phase heat pipes to each of the six slots, channeling heat away from the cards to the chassis heat exchanger and redundant TwoCool™ fan array.


“Red” and “Black” domains each employ a MIL-STD-1275 power supply module as well as a CPU and I/O combination module. Intel®’s next generation CPU (Xeon® W or Xeon® D) offers scalability with high-density performance. The OpenVPX I/O is reserved for future expansion and can be configured to match customer needs. Available capabilities include an Ethernet switch, NVIDIA®-based GPGPU for AI applications, NAS (network attached storage), fiber Ethernet, and more.


Cross domain data access is controlled by a TACLANE® (KG-175) certified HAIPE® Type 1encryptor that is NSA certified and uses the latest in crypto technology to provide high assurance protection of voice, video, and classified data.


High performance options include Nvidia® A4500 GPGPU for AI, vector processing, data mining, SDR, radar or image processing. Each Host CPU can be equipped with a GPU. Additionally, dual 100GigE fiber connections can be added to the Host CPUs to provide high-speed data pipes to out-of-box resources—this is an ideal way to provide up/down-link to additional processing resources or ultra high-rate sensors.


ENVIRONMENTAL SPECIFICATIONS

  • Size:

    7.62” (H) x 2.25” (W) x 19.52” (D)

  • Weight:

    30 lbs.

  • Power (W):

    Consult GMS - Power varies based on configuration.
    MIL-STD-1275 power supply accespts a wide range of input voltages

  • MIL-STD:

    MIL-STD-810, MIL-S-901, MIL-STD-461, 
    DO-160, optional MIL-STD-704

  • Temperature:

    Operates over extended temp -40°C to +85°C

BLOCK DIAGRAM

INSIDE THE SYSTEM

System shown with back cover removed

Our Mission

Since its inception in 1979, General Micro Systems, Inc. (GMS) has been true to its mission statement: To Become the World’s Leading Technology Independent Supplier of Computing Engines, while Providing the Best Price/Performance, Quality and Customer Support, Demanded by Our Current and Our Future Customers.

All GMS products are proudly designed and manufactured in the U.S.A.

Contact Us

General Micro Systems, Inc.
8358 Maple Pl. Rancho Cucamonga, CA 91730

Local (909) 980-4863
Toll Free (800) 307-4863

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