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Modularity on the Battlefield Makes Sense

Embedded Systems Engineering, Spring 2016

Originally Published in the Spring Issue of EMBEDDED SYSTEMS ENGINEERING: Military & Aerospace Guide

EMBEDDED SYSTEMS ENGINEERING, Spring 2016 – Battlefield equipment takes a beating: from the enemy, the environment, and sometimes from the warfighter. So planning for repairs, spares, and upgrades is essential. But while designing a system that “meets the requirements in the ORD” is where many designers stop, GMS CEO Ben Sharfi thinks designers should also consider building in modularity to allow for battlefield realities.

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Beating The Heat

COTS Journal, Vol.18, No.1, January 2016

Originally Published in the April Issue of MILITARY & AEROSPACE ELECTRONICS

MILITARY & AEROSPACE ELECTRONICS, VOL. 27, NO. 4, April, 2016 – In John Keller’s write up on “Beating the Heat” in the April 19, 2016 edition of Military & Aerospace Electronics, he examines the variety of ways to keep cool systems designed for military and defense. General Microsystems’ Chief Architect Ben Sharfi was John’s go-to guy for “the demands for high performance in embedded cooling”.

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2U Rackmount System Integrates Functionally of Four or More Servers

JEFF'S PICKS! JEFF'S TOP RACKMOUNT COMPUTER SYSTEMS

Originally Published in the January Issue of COTS JOURNAL

COTS JOURNAL, VOL. 18, NO. 1, January, 2016 – For many military applications the priority is to pack as much compute density into a system as possible. To achieve that, a popular choice is a rackmount blade-computer architecture. By using the 1U form factor, it’s easier to integrate together systems that include existing off-the-shelf IT-based 1U boards. Systems of larger sizes such as 2U, 3U and 4U are also gaining acceptance in military systems where compute density is paramount. Unlike backplane-based architectures like VME or CompactPCI, rackmount systems are bus-less and typically use Ethernet or other cable-based technology to link boards with one another.

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Rugged Computers Look To The Data Center

Virtual-machine technology, fast interconnects, innovative thermal-management techniques, and modular architectures bring data-center power to embedded computing.

Originally Published in the January Issue of MILITARY & AEROSPACE ELECTRONICS

MILITARY & AEROSPACE ELECTRONICS, VOL. 27, NO. 1, January, 2016 – Sometimes even more exotic thermal-management techniques are necessary, including refrigeration in which chassis are air-conditioned. Designers at General Micro Systems (GMS) in Rancho Cucamonga, Calif., are taking an entirely different approach with RuggedCool computers.

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