"MATRIX" U.2-TB3

Rugged, Sealed, Removable Conduction Cooled U.2 I/O Card with Thunderbolt™ 3 via USB-C, M.2 NVMe SSD and SAM I/O

Features

Features
- Removable U.2 form factor with NVMe interface supporting four lanes PCIe Gen 3
- Dual Thunderbolt™ 3 via USB-C
   - Up to 40 Gbps data transfer
   - Up to 27 W power delivery for each USB-C interface
   - USB 2.0 and USB 3.1 sideband channel per USB-C interface
   - Daisy chain capability
   - Optional locking connector (lose dual Type-C)
- Optional fixed M.2 SSD (optional encrypt/Secure Erase/Write Protect)
   - M.2 site may also be substituted for I/O via HD-BNC connector
- One SAM I/O site for custom I/O
   - HD-BNC or standards-specific connector for MIL-STD-1553, ARINC-429, Wi-Fi/BT, GPS, etc.
- Voltage/Temperature Monitoring Sensor on I2C bus
- 12V and 3.3V power input

SWaP-E (Size, Weight and Power - Efficiency)
- Industry's only U.2 module for TB 3 and expansion I/O utilizing NVMe interface (x4 PCIe Gen 3 lanes)
- Ultra-low SWaP at 2.6" x 0.5" x 4.0" (w x h x d), @ 0.5 lbs. and as low as 10 W - MIL-STD-810G, MIL-S-901D, DO-160D, MIL-STD-461E, IP64 compliant
- Operates up to extended temp -20°C to +75°C (Optional)
- Available in ruggedization levels R1-R3

Download Datasheet

Download

  • Applications

    The U.2-TB3 "Matrix" is a high-performance I/O and storage module for any system that requires I/O expansion without redesigning the system architecture. This module is a removable I/O expansion site that provides dual TB3, PCIe-Mini-based I/O and M.2 devices. This small form factor module can be installed virtually anywhere that supports 16 mm NVMe SSDs. Applications include remote sensor connectivity where data and power can share the same cable via TB3, surveillance, sensor-to-shooter, counter/interdiction, and C4ISR. It can also be used in industrial and commercial platforms. The U.2-TB3 is fully compliant to MIL-STD-810G, MIL-S-901D, DO-160D, MIL-STD-461E and has ingress protection up to IP64.
  • Description

    The U.2-TB3 "Matrix" is a rugged, small, lightweight, removable U.2 I/O module with embedded storage and Thunderbolt™ 3 (TB3) USB-C connectors. It is designed to provide the greatest density of I/O and storage possible in a fully ruggedized, conduction-cooled and sealed system, operating from -20°C to +75° C. This system architecture simplifies deployable MIL-SPEC technology by integrating several key functions in a small form factor chassis: dual Thunderbolt™ 3, SAM I/O expansion via PCIe-mini and M.2 SSD or I/O expansion. The U.2-TB3's small, ultra-rugged enclosure presents the greatest possible expansion module for any product that supports a standard NVMe PCIe x4 interface.

    Thunderbolt™ 3 is standard to Matrix, but can also be configured with SAM I/O and M.2 sites. TB3 provides on each USB-C interface: up to 27 W bi-directional power, up to 40 Gbps data transfer and USB 2.0/USB 3.1. SAM I/O supports either a standards-specific connector or an HD-BNC interface for I/O such as frame grabbers (1080p60Hz or Analog), MIL-STD-1553, ARINC-429, Wi-Fi/BT, GPS, etc. The M.2 site can support either one SSD or I/O expansion via one HD-BNC connector. In addition, Matrix can offer one locking USB-C connector.

    There are four standard variants of the Matrix, 1) v1 which offers two TB3 and two 3G-SDI Video Capture inputs, 2) v2 which offers two TB3, one M.2 SSD, and one SMA for RF I/O, 3) v3 which offers two TB3, one M.2 SSD and mini D-type connector, and 4) v4 one locking USB-C TB3.
  • Full Environmental Specs

    "Matrix" is available in ruggedization levels R1-R3. Additional information regarding the ruggedization levels and full environmental specifications for this product can be found on our website at www.gms4sbc.com/technologies/ruggedization.

 

 

 

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